MicroSystem Based on SiP Technology

Written as a reference for engineers who build System-in-Package products, this volume runs to 30 chapters grouped into three sections that move from underlying ideas to hands-on design and then to worked examples. The opening section introduces concepts the author has developed, including the Function Density Law, Si³P and 4D integration, alongside recent progress in SiP and advanced packaging.

The middle section concentrates on design and simulation. It covers wire bonding, multi-step cavities, chip stacking, 2.5D and 3D TSV, RDL, Fan-In and Fan-Out, flip chip, embedded passive and embedded chip structures, RF and rigid-flex design, and 4D SiP design. It also addresses multi-layout projects, team-based design, and signal integrity, power integrity, thermal, electrical and physical verification.

The final section works through one real design case to show how different types of SiP are designed, simulated and implemented, offering a practical model for research and development teams. Taken together, the book follows a product from the first idea through to finished hardware, explaining the reasoning and methods at each stage.