Power Electronic Packaging

Engineers working on power devices will find this book's coverage of packaging across its full life cycle: how components are designed, put together, tested for dependability, and modeled. Because building power packages differs sharply from manufacturing integrated circuits, the author walks through the typical design, assembly, reliability, and failure analysis steps, along with how materials are chosen, so each stage's particular demands are easy to grasp.

The field is expanding quickly as power IC production grows, driven by demand from portable gadgets, consumer and household products, computers, and cars. The text explains how progress in semiconductor content and in advanced package design has pushed power devices to perform better in recent years.

Looking ahead, the author projects current trends in these areas and points to where better materials and methods could keep progress moving. The focus falls on thermal management, ease of use, efficiency, reliability, and the overall cost of power semiconductor solutions.