RF and microwave microelectronics packaging

This professional reference looks at recent progress in packaging for high-frequency electronic systems. Engineers working in electronic packaging and RF design are its intended readers, along with academic researchers who want to follow the main challenges facing industry.

The book addresses heat dissipation and thermal control, the electrical, radio-frequency, and thermo-mechanical aspects of design and modeling, and the techniques used to assemble and process packages. It also touches on related areas of RF and microwave packaging.